In high-volume electronics manufacturing, Through-Hole Technology (THT) often becomes a hidden cost driver when not designed with manufacturing efficiency in mind. While SMD cost reductions are widely pursued, optimizing THT layout can unlock significant savings and improve quality
Challenge
Our client, manufacturing PCBs for a cost-sensitive application, faced a unique challenge, while SMD components were optimized for automated assembly, the THT section was not. Despite being a smaller portion of the total BOM, THT components disproportionately increased production costs due to manual handling, defect rates, and rework requirements.
Our Solution
Leveraging our deep expertise in Design for Manufacturing (DFM) and THT simulation, we conducted a focused analysis of the existing THT section and applied targeted design improvements:
THT Placement Optimization: Adjusted component orientation and spacing to align with solder wave flow, reducing bridging and cold joints.
Panel Layout Redesign: Modified the board layout to support efficient batch soldering, allowing better thermal profiles and uniform solder coverage.
Fixture Design Recommendations: Introduced customized wave solder pallets for multi-board setups, improving throughput in high-volume runs.
Process Simulation: Used simulation tools to model solder behavior, allowing us to preemptively eliminate defect-prone areas before production.
What We Achieved
Our smart placement strategy transformed THT from a cost bottleneck into a production-strength feature:
Cost Savings: Achieved up to 15% cost reduction per PCB through reduced manual touchpoints and lower rework.
Quality Uplift: Brought defect rates down to single digits per thousand boards, with some lines achieving zero-defect output for weeks.
Cycle Time Reduction: Improved line balancing and faster soldering reduced cycle times by 20–25%.
Scalable Manufacturing: Enabled stable high-volume production with minimal supervision and fewer line stoppages.